-
Sponge Sanding Blocks - High-Density Foam Contour Sanding | POLISHER
POLISHER Sponge Sanding Blocks feature a high-density foam cushioning design with excellent conformability, good wear resistance, and a uniform sanding finish. The textured grid pattern option ensures consistent abrasion — suitable for both dry and wet contour sanding.
-
Chemical Mechanical Planarization (CMP) Polishing Pads | POLISHER
POLISHER CMP Polishing Pads support nanoscale wafer planarization for semiconductor and 3C manufacturing. A complete three-stage system — Polyurethane Red, Non-Woven White, and Damped Fabric Black pads — is compatible with alumina, silica, and diamond slurries.
-
Conditioned Fabric Pad (Black) - Final CMP Polishing Step | POLISHER
POLISHER Conditioned Fabric Pad (Black) is the final CMP step for flawless surfaces on semiconductor chips and optical glass. Combines physical friction with chemical action, with hardness, density, and elasticity controlling precise polishing results.
-
White Non-Woven Pad - Versatile Mid-Stage CMP Solution | POLISHER
POLISHER White Non-Woven Pad delivers precision from coarse to fine for CMP wafer planarization. Specially treated base provides high absorbency and uniform removal on sapphire, silicon, and copper — a direct replacement for SUBA 600/800 series pads.
-
G-12 Polishing Compound - Alloy Wheel Mirror Polish | POLISHER
POLISHER G-12 Polishing Compound uses premium imported abrasives for mirror finishing on aluminum alloy and stainless steel wheels. Delivers excellent cutting performance, uniform particle size, and rapid gloss enhancement for wheel hub polishing.
-
POLISHER - Polyurethane Polishing Pad (Red)
POLISHER Polyurethane Polishing Pad (Red) is the workhorse for coarse polishing in CMP processes. Delivers powerful rough grinding for sapphire and silicon wafers, compatible with alumina, silica, silicon carbide, and diamond slurries.
-
POLISHER - P211 Polishing Compound
POLISHER P211 Polishing Compound quickly eliminates sandpaper marks on cast copper faucets with a non-separating formula. Delivers excellent cutting ability, a high-gloss result, and easy cleanup for bathroom fixture manufacturing.
-
P228 Polishing Compound
POLISHER P228 Polishing Compound uses imported abrasives and a proprietary formula for mirror polishing of cast copper-zinc alloy parts. Delivers excellent cutting power, uniform particle size, and rapid gloss development for bathroom fixtures.
-
P227-4/P227-4F Polishing Compound - Automotive Metal Buffing | POLISHER
POLISHER P227-4/P227-4F Polishing Compound delivers a non-separating formula, strong cutting power, and a high-gloss finish for automotive metal exterior trim. Achieves a 95%+ pass rate on roof rails, trim moldings, wheels, and exhaust tips.
-
Polishing Buffing Wheels for Hardware & Aluminum Alloy
POLISHER Buffing Wheels for Hardware & Aluminum Alloy offer rough wind, windmill, and shot-blasting cloth wheel options in multiple fabrics and sizes. Air-cooled construction delivers consistent, smooth polishing for metal and aluminum surfaces.
-
P0310 SiC Polishing Liquid - Nanoscale Wafer Planarization | POLISHER
POLISHER P0310 Polishing Liquid uses a potassium permanganate-based system with imported alumina abrasives (300nm) for SiC wafer polishing. Delivers high polishing efficiency and nanoscale planarization for semiconductor manufacturing.
-
P1532 Alumina Slurry - High-Efficiency Sapphire Polishing | POLISHER
POLISHER P1532 Alumina Slurry uses imported alumina abrasives (1.5um) for high-efficiency sapphire polishing. Delivers excellent dispersion and easy cleanup, making it ideal for intermediate-stage processing in sapphire manufacturing.
Our Products