POLISHER - Polyurethane Polishing Pad (Red)
Product Summary
POLISHER Polyurethane Polishing Pad (Red) is the workhorse for coarse polishing in CMP processes. Delivers powerful rough grinding for sapphire and silicon wafers, compatible with alumina, silica, silicon carbide, and diamond slurries.
Product Custom Attributes
Basic Properties
Product Description
Polyurethane Polishing Pad - Red Pad
The Workhorse for Coarse Polishing — The Powerhouse of Rough Grinding
POLISHER Polyurethane Polishing Pad (Red) is engineered as a powerhouse for rough grinding, delivering efficient coarse polishing performance in Chemical Mechanical Planarization (CMP) processes on sapphire and silicon wafers.
Key Features:
- Polyurethane Construction – Durable polymer material provides consistent, dependable performance under sustained coarse polishing conditions
- Powerful Rough Grinding – Engineered specifically for the demands of initial-stage coarse material removal
- Efficient Coarse Polishing – Your engine for fast, effective material removal at the start of the CMP process chain
- Compatible with Multiple Slurries – Works with alumina/cerium oxide and liquid applications including silica, silicon carbide, and diamond
- Customizable Specifications – Available in customizable configurations to meet specific process requirements
Applications:
Designed as the first stage in the CMP "coarse-to-polish" chain — ideal for the coarse polishing of sapphire and silicon wafers before intermediate and final-stage finishing.
Certifications: Manufactured under the ISO 9001 Quality Management System.
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