P0310 SiC Polishing Liquid - Nanoscale Wafer Planarization | POLISHER
Product Summary
POLISHER P0310 Polishing Liquid uses a potassium permanganate-based system with imported alumina abrasives (300nm) for SiC wafer polishing. Delivers high polishing efficiency and nanoscale planarization for semiconductor manufacturing.
Product Custom Attributes
Basic Properties
Product Description
P0310 Semiconductor / SiC Polishing Liquid
Potassium Permanganate-Based System for Nanoscale SiC Wafer Planarization
POLISHER P0310 Polishing Liquid is specifically formulated for polishing silicon carbide (SiC) wafers, combining a potassium permanganate-based system with imported alumina abrasives to achieve high polishing efficiency and nanoscale planarization.
Key Features:
- Potassium Permanganate System – Chemical-mechanical formulation engineered specifically for the demanding requirements of SiC wafer processing
- Imported Alumina Abrasives – High-quality alumina particles ensure consistent, dependable material removal
- High Polishing Efficiency – Delivers fast, effective processing while maintaining surface integrity
- Nanoscale Planarization – Achieves the ultra-flat surface finish required for advanced semiconductor applications
- Consistent Performance – Reliable 300nm grain size formulation for repeatable, high-precision results
Specifications:
- Pigment: Purple
- Abrasive Type: Alumina
- Grain Size: 300nm
- System: Potassium Permanganate
Applications:
Specifically designed for polishing silicon carbide (SiC) wafers in semiconductor manufacturing — ideal for applications requiring high-efficiency material removal and nanoscale surface planarization.
Certifications: Manufactured under ISO9001 Quality Management System certification.
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