Chemical Mechanical Planarization (CMP) Polishing Pads | POLISHER

Product Description

Chemical Mechanical Planarization (CMP)

Precision CMP Polishing Pads for Semiconductor & Sapphire Wafer Processing

Chemical Mechanical Planarization (CMP) is a process that combines chemical corrosion and mechanical grinding, primarily used for nanoscale planarization of wafer surfaces in 3C electronics and semiconductor manufacturing.

POLISHER CMP Polishing Pads are specifically engineered for CMP processes on materials such as sapphire and silicon wafers. The product line includes three main categories, each suited to a different stage of the polishing process.

Product Line Categories:

• Polyurethane Red Pads – For coarse polishing, delivering powerful rough grinding as the first stage of the process
• Non-Woven White Pads – For intermediate polishing, bridging coarse and fine processing stages with versatile mid-stage performance
• Damped Fabric Black Pads – For fine/final polishing, delivering the ultimate surface perfection at the last stage

Key Advantages:

• Broad Slurry Compatibility – Compatible with various polishing slurries, including alumina, ceria, silica, silicon carbide, and diamond
• Data-Verified Performance – Performance is data-verified to help enhance quality and efficiency in semiconductor and precision manufacturing
• Complete Coarse-to-Fine Chain – A full three-stage pad system covering the entire CMP polishing process

Applications:
Ideal for nanoscale wafer planarization in 3C electronics and semiconductor manufacturing — supporting sapphire, silicon, and related precision material processing