White Non-Woven Pad - Versatile Mid-Stage CMP Solution | POLISHER

Product Description

White Non-Woven Pad: The Versatile Mid-Stage Solution

POLISHER CMP White Pad — Precision from Coarse to Fine

POLISHER White Non-Woven Pad is a key consumable for wafer planarization in Chemical Mechanical Planarization (CMP) processes, engineered with a specially treated non-woven base for high absorbency and uniform material removal.

Key Features:

• Specially Treated Non-Woven Base – Engineered material technology delivers high absorbency and uniform material removal across the wafer surface
• Versatile Mid-Stage Performance – Precision performance bridging coarse polishing and fine finishing stages
• Direct Replacement – Fully compatible alternative to SUBA 600/800 series pads, simplifying supply chain switching
• Broad Material Compatibility – Suitable for sapphire, silicon wafers, and copper layers across coarse-to-fine polishing
• Precision Finishing – Meets exacting precision finishing needs for sapphire lenses and silicon substrates

Role in CMP Process:
Serves as a key consumable for wafer planarization, positioned as the versatile mid-stage solution between coarse polyurethane pads and fine damped fabric pads.

Applications:
Ideal for sapphire, silicon wafer, and copper layer polishing in semiconductor and precision manufacturing — supporting coarse-to-fine processing in a single pad solution.

Certifications: Manufactured under ISO9001 Quality Management System certification.