Baolishi Grinding Technology (Changzhou) Co., Ltd. Products Online

POLISHER A-2 Polishing Wax is a machine mirror polishing wax for fine polishing of stainless steel and 7-series aluminum alloy. Delivers strong cutting power, a scratch-free finish, and no residue for 3C, aluminum, and titanium alloy applications.

POLISHER D-24 Polishing Wax is a complete domestic alternative to imported waxes for fine polishing of titanium alloy, stainless steel, and jewelry. Delivers moderate oil content, rapid gloss output, and a streak-free finish with high versatility.

POLISHER D-36 Polishing Wax uses a Japanese-identical formulation as a direct substitute for imported wax. Delivers strong cutting power, fast gloss output, and a streak-free finish for titanium alloy, stainless steel, gold, and silver jewelry.

POLISHER P229-3-11 Polishing Wax is an upgraded medium-coarse wax benchmarked to GW 16 Polishing Wax. Delivers excellent cutting power, a scratch-free finish, and fast gloss development on painted finishes, acrylic, phenolic resin, and billiards.

POLISHER P08 High-Gloss Wax uses imported greases and customized abrasives for precision polishing of titanium alloy and stainless steel. Delivers powerful cutting force, a rapid mirror finish, and effectively prevents pitting on titanium alloy.

POLISHER Sponge Sanding Blocks feature a high-density foam cushioning design with excellent conformability, good wear resistance, and a uniform sanding finish. A textured surface option ensures consistent abrasion — suitable for both dry and wet contour sanding.

POLISHER Diamond Grinding Sticks and Abrasive Belts deliver a full coarse-to-polish chain with high-purity diamond grains. They last 3-5x longer than traditional tools, cut costs, reduce dust, and are ideal for FRP, wind turbine blades, molds, and hard alloys.

POLISHER Sponge Sanding Blocks feature a high-density foam cushioning design with excellent conformability, good wear resistance, and a uniform sanding finish. The textured grid pattern option ensures consistent abrasion — suitable for both dry and wet contour sanding.

POLISHER CMP Polishing Pads support nanoscale wafer planarization for semiconductor and 3C manufacturing. A complete three-stage system — Polyurethane Red, Non-Woven White, and Damped Fabric Black pads — is compatible with alumina, silica, and diamond slurries.

POLISHER Conditioned Fabric Pad (Black) is the final CMP step for flawless surfaces on semiconductor chips and optical glass. Combines physical friction with chemical action, with hardness, density, and elasticity controlling precise polishing results.

POLISHER White Non-Woven Pad delivers precision from coarse to fine for CMP wafer planarization. Specially treated base provides high absorbency and uniform removal on sapphire, silicon, and copper — a direct replacement for SUBA 600/800 series pads.

POLISHER G-12 Polishing Compound uses premium imported abrasives for mirror finishing on aluminum alloy and stainless steel wheels. Delivers excellent cutting performance, uniform particle size, and rapid gloss enhancement for wheel hub polishing.