Chemical Mechanical Planarization (CMP)
Product Summary
Chemical Mechanical Planarization (CMP) is a process that combines chemical corrosion and mechanical grinding, primarily used for nanoscale planarization of wafer surfaces in 3C electronics and semiconductor manufacturing. Baolishi CMP Polishing Pads are specifically engineered for CMP processes on ...
Product Custom Attributes
Product Description
Chemical Mechanical Planarization (CMP)
is a process that combines chemical corrosion and mechanical grinding, primarily used for nanoscale planarization of wafer surfaces in 3C electronics and semiconductor manufacturing.
Baolishi CMP Polishing Pads are specifically engineered for CMP processes on materials like sapphire and silicon wafers. The product line includes three main categories:
· Polyurethane Red Pads: For coarse polishing.
· Non-Woven White Pads: For intermediate polishing.
· Damped Fabric Black Pads: For fine / final polishing.
These pads are compatible with various polishing slurries, including alumina, ceria, silica, silicon carbide, and diamond. Performance is data-verified to help enhance quality and efficiency in the semiconductor and precision manufacturing industries.
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