White Non-Woven Pad: The Versatile Mid-Stage Solution
Product Summary
White Non-Woven Pad: The Versatile Mid-Stage Solution POLISHER CMP White Pad: Precision from Coarse to Fine · Role: A key consumable for wafer planarization in CMP processes. · Material Tech: Specially treated non-woven base for high absorbency & uniform material removal. · Best For: Sapphire, ...
Product Custom Attributes
Product Description
White Non-Woven Pad: The Versatile Mid-Stage Solution
POLISHER CMP White Pad: Precision from Coarse to Fine
· Role: A key consumable for wafer planarization in CMP processes.
· Material Tech: Specially treated non-woven base for high absorbency & uniform material removal.
· Best For: Sapphire, silicon wafers, and copper layers (coarse to fine polishing).
· Direct Replacement: Fully compatible alternative to SUBA 600/800 series pads.
· Versatility: Meets precision finishing needs for sapphire lenses and silicon.
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