POLISHER - P1530B Sapphire Lapping Slurry
Product Summary
POLISHER P1530B Sapphire Lapping Slurry uses clustered diamond abrasives (30 μm) for uniform particle distribution and a high removal rate. Ideal for precision grinding of sapphire A-plane and C-plane surfaces in semiconductor manufacturing.
Product Custom Attributes
Basic Properties
Product Description
P1530B Sapphire Lapping Slurry
Clustered Diamond Slurry for High-Removal-Rate Sapphire Grinding
POLISHER P1530B Sapphire Lapping Slurry is formulated with clustered diamond abrasives, delivering uniform particle distribution and a high material removal rate for precision sapphire processing.
Key Features:
- Clustered Diamond Formulation – High-purity diamond clusters deliver aggressive, consistent cutting performance
- Uniform Particle Distribution – Ensures even grinding action across the entire surface for predictable, repeatable results
- High Removal Rate – Efficiently processes hard sapphire material, reducing cycle time in production
- Precision Plane Processing – Specifically suited for accurate grinding of sapphire A-plane and C-plane surfaces
- Reliable Performance – Consistent grain size (30um) delivers stable, dependable grinding results batch after batch
Specifications:
- Pigment: Ash
- Abrasive Type: Diamond
- Grain Size: 30 um
Applications:
Ideal for diamond grinding of sapphire wafers — specifically formulated for precision processing of sapphire A-plane and C-plane surfaces in semiconductor and optical component manufacturing.
Certifications: Manufactured under the ISO 9001 Quality Management System.
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